Process steps of SMT patch processing

Let's briefly introduce the process steps of SMT patch processing:

1. Dispensing: it is to drop glue on the fixed position of PCB. Its specific function is to place electronic devices on PCB. The equipment used is a dispensing machine, which is located at the front end of the SMT production line or behind the testing instrument.

2. Mounting: its function is to accurately install the externally assembled electronic devices to the fixed position of PCB. The machine used is the SMT placement machine, which is located behind the screen printing machine in the SMT placement processing production line.

3. Curing: SMT patch processing adopts curing, which has the effect of melting the patch adhesive, so as to firmly bond the surface assembled components with the PCB board. The equipment used is a curing furnace, which is located behind the mounter in the SMT production line.

4. Cleaning: its function is to remove the welding residues harmful to the body, such as flux, on the assembled PCB. The machine used is a cleaning machine. The part can be fixed, online or not necessarily online.

5. Repair: its function is to rework the PCB board with fault. Common tools are soldering iron, maintenance workstation, etc. Configure at any position in the production line.

The above is about the process steps of SMT patch processing. I hope it can help you. If you want to know more about SMT patch processing, you can click the website page of SMT patch processing to browse!