Smart home motherboard SMT patch processing
Dongguan Tangxia PCBA processing precautions
Dongguan Tangxia PCBA processing is a strict process. If you don't pay attention to it, there will be production accidents. If it is light, the circuit board will be damaged, resulting in economic losses; If the situation is serious, safety accidents will occur and threaten personal safety. Therefore, during the processing of Dongguan Tangxia PCBA, designers and workers must strictly understand the precautions during the processing of Dongguan Tangxia PCBA:
1. The minimum distance between the PCBA processed copper foil and the plate edge of Dongguan Tangxia is 0.5mm, the minimum distance between the components and the plate edge is 5.0mm, the minimum distance between the pad and the plate edge is 4.0mm, the minimum gap between the single plate copper foil is 0.3mm, and the minimum gap between the double plate copper foil is 0.2mm. (when designing the double-sided board, please pay attention to the parts of the metal shell. If the shell needs to contact the printed circuit board during insertion, the pad on the top layer cannot be opened and must be sealed with screen printing oil or solder resist oil.)
Dongguan Tangxia PCBA processing which good
2. Dongguan Tangxia PCBA processing electrolytic capacitor is strictly prohibited from contacting heating elements, such as transformer, thermistor, high-power resistor and radiator. The minimum distance between the radiator and the electrolytic capacitor is 10mm, and the distance between other components and the radiator is 2.0mm. Minimum line width: single board 0.3mm, double-sided board 0.2mm (edge copper foil 1.0mm).
3. There shall be no copper foil (except grounding) and components (or as required by the structural drawing) within 5mm of the radius of the screw hole. Generally, the gasket size (diameter) of Dongguan Tangxia PCBA processing through-hole mounting assembly is twice that of the hole. The minimum size of double-sided paperboard is 1.5mm, and the minimum size of a single panel is 2.0mm (if a circular pad cannot be used, a circular pad at the waist can be used.)
4. The center distance of the backing plate is less than 2.5mm. There shall be a silk screen oil package around the adjacent backing plate processed by Dongguan Tangxia PCBA, and the width of the silk screen oil is 0.2mm. For the parts to be welded after passing through the tin furnace, the solder pad shall open the tin in the opposite direction to the direction of tin passing through. 0.5mm to 1.0mm, mainly used for middle and rear welding pads on one side to avoid blockage when passing through the furnace.
5. In the design of large-area printed circuit board (more than 500 cm), in order to prevent the printed circuit board from bending when passing through the tin furnace, a gap of 5 mm to 10 mm should be left in the middle of the PCBA processed printed circuit board in Dongguan Tangxia to avoid placing components (wireable), so as to add slats when passing through the tin furnace to prevent bending. In order to reduce the short circuit of solder joints, it is forbidden to open the solder resist window for all double-sided plates and vias.
The above are the precautions for Dongguan Tangxia PCBA processing. I hope it will be helpful to you. If you want to know more about Dongguan Tangxia PCBA processing, please click our website to browse! Dongguan xingenyu Electronics Co., Ltd. xingenyu electronics is a powerful manufacturer specializing in SMT patch processing, Dongguan Tangxia PCBA processing, dip plug-in post welding processing, cob bonding processing, electronic product assembly processing and patch OEM / ODM OEM.
COB邦定加工的封装流程
COB邦定加工封装流程步骤一:扩晶。制造商提供的整个发光二极管晶片薄膜均通过扩张器均匀扩张,使得附着在薄膜表面且排列紧密的发光二极管晶粒被拉开,刺晶方便。
COB邦定加工封装流程步骤二:背胶。将带有膨胀晶体的晶体膨胀环放在已刮去银膏层的背胶机表面,并用银膏将其背上。银浆。适用于大块发光二极管芯片。使用点胶机在印刷电路板上点胶适量。
COB邦定加工哪家好
COB邦定加工封装流程步骤三:将备好银浆的扩晶环放入挑晶框中,操作者在显微镜下用挑晶笔将印刷电路板上的发光二极管芯片刺破。
COB邦定加工封装流程步骤四:将刺有晶体的印刷电路板放入热循环烘箱中,恒温放置一段时间,待银浆固化后取出(不要长时间放置,否则发光二极管芯片涂层会被烤黄,即氧化,导致键合困难)。如果要焊接发光二极管芯片,需要执行上述步骤。如果只焊接集成电路芯片,取消上述步骤。
COB邦定加工封装流程步骤五:粘合芯片。使用点胶机在印刷电路板上的集成电路位置放置适量的红胶(或黑胶),然后使用抗静电设备(真空吸笔)将集成电路管芯正确放置在红胶或黑胶上。
COB邦定加工封装流程步骤六:干燥。将粘合模具放入热循环烘箱中,放在大平面加热板上保持恒温一段时间,也可以自然固化(长时间)。
COB邦定加工封装流程步骤七:焊接(引线焊接)。铝线焊接机用于将芯片(发光二极管芯片或集成电路芯片)与印刷电路板上相应的焊盘铝线桥接,即焊接COB的内引线。
COB邦定加工封装流程步骤八:预测试。使用专用测试工具(COB根据不同的用途有不同的设备,简单的高精度稳压电源)来测试COB板并返工不合格的板。
COB邦定加工封装流程步骤九:点胶。用点胶机将适量的准备好的AB胶放在键合好的发光二极管管芯上。集成电路用黑胶封装,然后根据客户要求封装。
COB邦定加工封装流程步骤十:固化。将密封好的印刷电路板放入热循环烘箱中恒温,可以根据需要设定不同的干燥时间。
COB邦定加工封装流程步骤十一:后测试。用特殊的测试工具将封装好的印刷电路板的电气性能,以区分好坏。
COB邦定加工封装技术与其它封装技术相比,COB邦定加工技术价格低廉(仅为同芯片的1/3左右)、节约空间、工艺成熟。
SMT贴片加工常见问题及解答
SMT贴片加工是怎样进行收费的?
本公司在进行SMT贴片加工是按照PCB文件,BOM清单来算出加工总金额,少量产品会收取相应的起步费。
SMT贴片加工质量怎么样?
本公司在进行SMT贴片加工时采用自动光学检测,目视检测,合格率在99%以上,出现少料缺料情况我们将分开进行包装.。
SMT贴片加工是什么?
SMT贴片加工也就是表面贴装技术,就是把片状结构的元器件或适合于表面组装的小型化元器件按照要求放置在PCB板的表面上然后使用回流焊等焊接工艺焊接起来,完成电子元器件组装的技术。
SMT贴片加工哪家好
SMT贴片加工的注意事项有哪些?
SMT贴片加工工作区域内不得有食物或饮料,严禁吸烟,不得放置与工作有关的杂物,维持好干净整洁。对于SMT贴片加工敏感的部件和产品,必须适当的进行标记,以防止与其他部件混淆。焊在SMT贴片加工表面上的贴片不能用手或手指进行拾取,因为手部的油量会使焊接产生缺陷。
SMT贴片加工的优势有哪些?
SMT贴片加工的优势:组装密度高、电子产品体积小、重量轻,SMT贴片加工元件的体积和重量只有传统插装元件的十分之一左右,采用SMT贴片加工之后,电子产品体积缩小40%~60%,重量减轻60%~80%。 可靠性高、抗振能力强,焊点缺陷率低,高频特性好,减少了电磁和射频干扰。SMT贴片加工容易实现自动化,提高生产效率。降低成本达30%~50%。节省材料、能源、设备、人力、时间等。