Temperature controller motherboard SMT patch processing

Temperature controller motherboard SMT patch processing

Assembly method of SMT patch processing

According to the specific requirements of assembly products and the conditions of assembly equipment, selecting appropriate assembly methods is not only the basis of high-efficiency and low-cost assembly production, but also the main content of SMT patch processing process design. The so-called surface assembly technology refers to the assembly technology of electronic components with certain functions by placing the sheet structure or miniaturized components suitable for surface assembly on the surface of printed circuit board and assembling them through reflow soldering or wave soldering and other welding processes according to the requirements of the circuit.

SMT patch processing which good

SMT patch processing single-sided hybrid assembly method: the first is single-sided hybrid assembly, that is, the patch / patch and through-hole plug-in (17hc) are distributed on different surfaces of the printed circuit board for hybrid assembly, but their welding surface is only one side. This assembly method adopts single-sided printed circuit board and wave soldering (now double wave soldering is generally used). There are two specific assembly methods. Process the patch first. The first assembly method is called the first welding method, that is, first stick the patch / patch on side B (welding surface) of the printed circuit board, and then insert the patch into side a. Post treatment and pasting method of patch. The second assembly method is called post bonding method. First insert THC on side a of PCB, and then paste SMD on side B.

SMT patch processing is a double-sided hybrid assembly method. The second type is a two-sided hybrid component. Surface assembly / surface assembly and thermal curing can be mixed and distributed on the same side of PCBs. At the same time, SMC / SMD can also be distributed on both sides of the. The double-sided hybrid assembly adopts double-sided printed circuit board, double wave soldering or reflow soldering. In this assembly mode, there is also a difference between sticking the patch / patch first or sticking the patch / patch later. Generally speaking, it is reasonably selected according to the type of SMC / SM and the size of printed circuit board. The first paste method is usually used.

Two assembly methods are commonly used to process and assemble such patches. SMC / SMD and ifhc are on the same side, SMC / SMD and thc are on the same side. On different sides of SMC / SMD and integrated circuit, SMC and thc are placed on side a of PCB, while SMC and sot are placed on side B. This type of SMT patch processing and assembly method has relatively high assembly density because SMC / SMD is attached to one or both sides of the printed circuit board, and lead-in elements that are difficult to be surface assembled are inserted and assembled.

The assembly method and process flow of SMT chip processing mainly depend on the type of surface assembly parts, the type of parts used and the conditions of assembly equipment. Generally speaking, shape memory alloys can be divided into three types: single-sided hybrid assembly, double-sided hybrid assembly and full surface assembly, with a total of 6 assembly methods. Different types of shape memory alloys have different assembly methods, and the same type of shape memory alloys can also have different assembly methods.

The above explanation is the assembly method of SMT patch processing. I hope it will be helpful to you. If you want to know more information about SMT patch processing, you are welcome to consult customer service online or call our service hotline (the upper right corner of the website). We will wholeheartedly provide you with high-quality services!