SMT chip processing of fast charging main board of new energy charging pile

SMT chip processing of fast charging main board of new energy charging pile

Assembly process of SMT patch processing

The assembly method and process flow of SMT chip processing mainly depend on the type of surface assembly assembly assembly (SMA), the type of components used and the conditions of assembly equipment. Generally, it can be divided into single-sided assembly, double-sided assembly, single-sided mixed loading, double-sided mixed loading and other assembly methods. Different types of assembly methods are different, and the assembly methods of the same type may be different.

Which company is good for SMT patch processing

Single side assembly process of SMT patch processing: incoming material detection = > silk screen solder paste (point patch adhesive) = > patch = > drying (curing) = > reflow soldering = > cleaning = > detection = > repair.

Double sided assembly process of SMT patch processing: 1. Incoming material detection = > screen printing solder paste on side a of PCB (point patch adhesive) = > screen printing solder paste on side B of patch PCB (point patch adhesive) = > patch = > drying = > reflow soldering (it is best to only use side B = > cleaning = > detection = > repair). 2. B: incoming inspection = > screen printing solder paste on side a of PCB (spot patch adhesive) = > patch = > drying (curing) = > reflow soldering on side a = > cleaning = > turnover = spot patch adhesive on side B of PCB = > patch = > curing = > wave soldering on side B = > cleaning = > inspection = > repair).

SMT patch processing single-sided mixed assembly method is as follows:

The first type is SMT patch processing and single-sided hybrid assembly, that is, SMC / SMD and through-hole plug-in components (17hc) are mixed on different sides of PCB, but the welding surface is only one side. This kind of assembly method adopts single-sided PCB and wave soldering (now double wave soldering is generally used), and there are two specific assembly methods.

(1) Paste it first. The first assembly method is called the first paste method, that is, SMC / SMD is first pasted on surface B (welding surface) of PCB, and then thc is inserted on surface a.

(2) Post paste method. The second assembly method is called post pasting method, which is to insert THC on side a of PCB first, and then paste SMD on side B.

SMT patch processing double-sided hybrid assembly method:

The second type is SMT patch processing and double-sided hybrid assembly. SMC / SMD and t.hc can be mixed and distributed on the same side of PCB. At the same time, SMC / SMD can also be distributed on both sides of PCB. Double sided hybrid assembly adopts double-sided PCB, double wave soldering or reflow soldering. There are also differences between SMC / SMD pasting first and SMC / SMD pasting later in this kind of assembly mode. Generally, it is reasonably selected according to the type of SMC / SMD and the size of PCB, and the first pasting method is usually adopted. There are two common assembly methods for this kind of assembly.

(1) SMC / SMD and ifhc are on the same side, and SMC / SMD and thc are on the same side of. PCB.

(2) SMC / SMD and ifhc have different side modes. The surface mount integrated chip (SMIC) and thc are placed on the a side of the PCB, while the SMC and small shape transistor (SOT) are placed on the B side.

This kind of SMT chip processing and assembly method has high assembly density because SMC / SMD is pasted on one or both sides of PCB, and lead components that are difficult to be surface assembled are inserted into assembly.