Bluetooth keyboard assembly and processing

Bluetooth keyboard assembly and processingWhat are the relevant processes of DIP plug-in processing? DIP plug-in processing related processes: preparation → first piece → object shaping → plug-i

  • Model: Bluetooth keyboard assembly and processing

Bluetooth keyboard assembly and processing


What are the relevant processes of DIP plug-in processing?


       DIP plug-in processing related processes: preparation → first piece → object shaping → plug-in → over furnace → post-welding (execution tin) → plate washing → burning → test → packaging


DIP plug-in processing   


   1. Tin-adding: It is a kind of process in which the staff will add tin to some plug-ins in the future. The tin-through process is a special plug-in demand that uses one side to increase the time of tin penetration into the other side.

   2. The object materials are those sharper materials, such as diodes, capacitors, relays, connectors, resistors, etc., which are larger than the flat patch materials.

  3. Customer renewal, we do virtual function test, our business needs to provide the production test conditions (software, materials, functions, voltage, current, etc.);

   4. In the future, after plug-in board protection, it is necessary to check each plug-in one by one, and then add a process of tin for some special equipment;

   5. Post-welding is about the process of strengthening the addition of tin to some equipment after the protection process. The plug-in is to insert the plug-in materials into the board.

   6. According to the requirements, take the material as the required shape to shape the material, such as cathode, diode, capacitor;




   7. Must satisfy satisfied people, materials, related operation instructions, and use plug-ins to produce




   8. The maximum wave soldering limit is 450ma, the minimum is 20mm




   9. The post-welding production capacity is 450 per hour, and the labor is about 400






See here, everyone should know more or less about the DIP patch processing process? For customers in need, only by choosing the right DIP plug-in processing plant can the quality and delivery time of electronic products be guaranteed, and it is truly worry-free.


蓝牙键盘组装加工


smt贴片加工中DIP插件加工的工艺流程

随着【SMT贴片加工】技术的飞速发展,贴片加工逐渐取代了【DIP插件加工】。然而,由于【PCBA】生产过程中一些电子元器件尺寸较大,插件加工一直没有被取代,在电子组装过程中仍然发挥着重要的作用。DIP插件加工是SMT芯片加工后,一般采用流水线【手动插件】,这需要很多员工。如下图


smt贴片加工中DIP插件加工的工艺流程


浸入式插件加工的工艺流程一般可分为:【组件成型加工】→【插件】→【波峰焊】→【组件切割】→【补焊(焊后)】→【洗板】→【功能测试】






1、【预处理组件】


首先,预加工车间的工作人员根据物料清单从物料中提取物料,仔细核对物料的型号、规格,并签字,根据样品进行预加工,并采用全自动体电容剪切机、全自动晶体管成型机、全自动皮带成型机等成型设备进行加工。




2、【插件】


将加工好的元器件插入PCB板的相应位置,准备过波焊接。




3、【波峰焊】


将插好插件的PCB板放入波峰焊输送带,通过喷焊剂、预热、波峰焊、冷却等环节完成PCB板的焊接。




4、【元件断流器】


焊后切割PCBA板脚,使其尺寸合适。




5、【补焊(焊后)】


未焊透的PCBA成品板应进行补焊和维护。




6、【洗脸板】


清洁多氯联苯产品上残留的助焊剂等有害物质,达到顾客要求的环保标准清洁度。




7、【功能测试】


元器件焊接完毕后,对PCBA成品板进行功能测试,测试各项功能是否正常。如果发现功能缺陷,应进行修复和重新测试。


蓝牙键盘组装加工