SMT chip processing of smart home motherboard

SMT chip processing of smart home motherboardPrecautions for PCBA processing in Dongguan Tangxia  Dongguan Tangxia PCBA processing is a strict process. If you don't pay attention to it, there will

  • Model: SMT chip processing of smart home motherboard

SMT chip processing of smart home motherboard




Precautions for PCBA processing in Dongguan Tangxia


  Dongguan Tangxia PCBA processing is a strict process. If you don't pay attention to it, there will be a production accident. If it is light, the circuit board will be damaged, causing economic losses; if the situation is serious, a safety accident will occur, threatening personal safety. Therefore, in the process of PCBA processing in Dongguan Tangxia, designers and workers must strictly understand the precautions in the process of PCBA processing in Dongguan Tangxia:


 


1. The minimum distance between PCBA processed copper foil and board edge of Dongguan Tangxia is 0.5 mm, the minimum distance between components and board edge is 5.0 mm, the minimum distance between pad and board edge is 4.0 mm, and the distance between single board copper foil The minimum gap is 0.3 mm, and the minimum gap between double-sided copper foil is 0.2 mm. (When designing the double-sided board, please pay attention to the parts of the metal casing. If the casing needs to contact the printed circuit board during the insertion process, the pad on the top layer cannot be opened, and it must be sealed with screen printing oil or solder resist oil.)


Which is better for Dongguan Tangxia PCBA processing


   2. Dongguan Tangxia PCBA processing electrolytic capacitors are strictly prohibited from contacting heating elements, such as transformers, thermistors, high-power resistors and radiators. The minimum distance between the heat sink and the electrolytic capacitor is 10 mm, and the distance between other components and the heat sink is 2.0 mm. Minimum line width: single board 0.3 mm, double board 0.2 mm (edge copper foil 1.0 mm).


 


   3. There should be no copper foil (except grounding) and components (or structural drawing requirements) within 5 mm of the screw hole radius. Generally, the size (diameter) of the PCBA processed through-hole mounting assembly in Tangxia Dongguan is twice that of the hole. The minimum size of double-sided cardboard is 1.5 mm, and the minimum size of a single panel is 2.0 mm (If a round pad is not available, a round pad for the waist can be used.)


 


4. The center distance of the backing plate is less than 2.5 mm. There should be a silk screen oil package around the adjacent backing plate of PCBA processing in Tangxia, Dongguan. The width of the screen printing oil is 0.2 mm. For the parts that need to be welded after passing through the tin furnace, the pad opens the tin, the direction and the tin The direction of passage is opposite. 0.5mm to 1.0mm, mainly used for one side of the middle and rear solder pads to avoid blockage when passing through the furnace.


 


5. In the design of large-area printed circuit boards (about 500 cm or more), in order to prevent the printed circuit board from bending when passing through the tin furnace, there should be a gap of 5 mm to 10 mm in the middle of the printed circuit board processed by PCBA in Dongguan Tangxia. So as not to place components (can be routed), so as to add slats to prevent bending when passing through the tin furnace. In order to reduce the solder joint short circuit, it is forbidden to open the solder mask window on all double-sided boards and vias.


 


  The above is the Dongguan Tangxia PCBA processing precautions, I hope that after reading can help you, if you still want to learn more about Dongguan Tangxia PCBA processing related information, please click on our company website to browse! Dongguan Xing Enyu Electronics Co., Ltd. Xing Enyu Electronics is a Dongguan Tangxia company specializing in SMT chip processing, Dongguan Tangxia PCBA processing, DIP plug-in post-welding processing, COB bonding processing, electronic product assembly processing, chip OEM/ ODM OEM's powerful processing manufacturer.


COB邦定加工的封装流程

  COB邦定加工封装流程步骤一:扩晶。制造商提供的整个发光二极管晶片薄膜均通过扩张器均匀扩张,使得附着在薄膜表面且排列紧密的发光二极管晶粒被拉开,刺晶方便。

 

  COB邦定加工封装流程步骤二:背胶。将带有膨胀晶体的晶体膨胀环放在已刮去银膏层的背胶机表面,并用银膏将其背上。银浆。适用于大块发光二极管芯片。使用点胶机在印刷电路板上点胶适量。

COB邦定加工哪家好

  COB邦定加工封装流程步骤三:将备好银浆的扩晶环放入挑晶框中,操作者在显微镜下用挑晶笔将印刷电路板上的发光二极管芯片刺破。

 

  COB邦定加工封装流程步骤四:将刺有晶体的印刷电路板放入热循环烘箱中,恒温放置一段时间,待银浆固化后取出(不要长时间放置,否则发光二极管芯片涂层会被烤黄,即氧化,导致键合困难)。如果要焊接发光二极管芯片,需要执行上述步骤。如果只焊接集成电路芯片,取消上述步骤。

 

  COB邦定加工封装流程步骤五:粘合芯片。使用点胶机在印刷电路板上的集成电路位置放置适量的红胶(或黑胶),然后使用抗静电设备(真空吸笔)将集成电路管芯正确放置在红胶或黑胶上。

 

  COB邦定加工封装流程步骤六:干燥。将粘合模具放入热循环烘箱中,放在大平面加热板上保持恒温一段时间,也可以自然固化(长时间)。

 

  COB邦定加工封装流程步骤七:焊接(引线焊接)。铝线焊接机用于将芯片(发光二极管芯片或集成电路芯片)与印刷电路板上相应的焊盘铝线桥接,即焊接COB的内引线。

 

  COB邦定加工封装流程步骤八:预测试。使用专用测试工具(COB根据不同的用途有不同的设备,简单的高精度稳压电源)来测试COB板并返工不合格的板。

 

  COB邦定加工封装流程步骤九:点胶。用点胶机将适量的准备好的AB胶放在键合好的发光二极管管芯上。集成电路用黑胶封装,然后根据客户要求封装。

 

  COB邦定加工封装流程步骤十:固化。将密封好的印刷电路板放入热循环烘箱中恒温,可以根据需要设定不同的干燥时间。

 

  COB邦定加工封装流程步骤十一:后测试。用特殊的测试工具将封装好的印刷电路板的电气性能,以区分好坏。

 

  COB邦定加工封装技术与其它封装技术相比,COB邦定加工技术价格低廉(仅为同芯片的1/3左右)、节约空间、工艺成熟。


SMT贴片加工常见问题及解答

SMT贴片加工是怎样进行收费的?

  本公司在进行SMT贴片加工是按照PCB文件,BOM清单来算出加工总金额,少量产品会收取相应的起步费。

 

SMT贴片加工质量怎么样?

  本公司在进行SMT贴片加工时采用自动光学检测,目视检测,合格率在99%以上,出现少料缺料情况我们将分开进行包装.。

 

SMT贴片加工是什么?

  SMT贴片加工也就是表面贴装技术,就是把片状结构的元器件或适合于表面组装的小型化元器件按照要求放置在PCB板的表面上然后使用回流焊等焊接工艺焊接起来,完成电子元器件组装的技术。

SMT贴片加工哪家好

SMT贴片加工的注意事项有哪些?

  SMT贴片加工工作区域内不得有食物或饮料,严禁吸烟,不得放置与工作有关的杂物,维持好干净整洁。对于SMT贴片加工敏感的部件和产品,必须适当的进行标记,以防止与其他部件混淆。焊在SMT贴片加工表面上的贴片不能用手或手指进行拾取,因为手部的油量会使焊接产生缺陷。

 

SMT贴片加工的优势有哪些?

  SMT贴片加工的优势:组装密度高、电子产品体积小、重量轻,SMT贴片加工元件的体积和重量只有传统插装元件的十分之一左右,采用SMT贴片加工之后,电子产品体积缩小40%~60%,重量减轻60%~80%。 可靠性高、抗振能力强,焊点缺陷率低,高频特性好,减少了电磁和射频干扰。SMT贴片加工容易实现自动化,提高生产效率。降低成本达30%~50%。节省材料、能源、设备、人力、时间等。